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Transcend MTE370T 512 GB M.2 PCI Express 3.0 NVMe 3D NAND
SKU
TS512GMTE370T
- Supports NVM command
- SLC caching technology
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
- NCQ command for better performance
- Full drive encryption with Advanced Encryption Standard (AES) (optional)
| SKU | TS512GMTE370T |
|---|---|
| EAN | 0760557858782 |
| Manufacturer | Transcend |
| Availability | Out of Stock |
Transcend's M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30µ" gold finger PCB and Corner Bond technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃~75℃.
| Hard drive | |
|---|---|
| PCI Express interface data lanes | x4 |
| SSD capacity | 512 GB |
| Memory type | 3D NAND |
| Data transmission | |
| Read speed | 2000 MB/s |
| Write speed | 1100 MB/s |
| Random write (4KB) | 220000 IOPS |
| Random read (4KB) | 90000 IOPS |
| Endurance | |
| Mean time between failures (MTBF) | 3000000 h |
| Features | |
| Interface | PCI Express 3.0 |
| Component for | Laptop |
| NVMe | Yes |
| NVMe version | 1.3 |
| TBW rating | 480 |
| PCI Express interface data lanes | x4 |
| SSD capacity | 512 GB |
| S.M.A.R.T. support | Yes |
| Read speed | 2000 MB/s |
| TRIM support | Yes |
| Write speed | 1100 MB/s |
| ECC | Yes |
| Memory type | 3D NAND |
| Random write (4KB) | 220000 IOPS |
| Random read (4KB) | 90000 IOPS |
| Native Command Queuing (NCQ) | Yes |
| Mean time between failures (MTBF) | 3000000 h |
| Certification | CE, FCC, BSMI, UKCA |
| SSD form factor | M.2 |
| M.2 key ID | M |
| Power | |
| Power consumption (idle) | 0.4 W |
| Operating voltage | 3.3 V |
| Certificates | |
|---|---|
| Certification | CE, FCC, BSMI, UKCA |
| Performance | |
| Interface | PCI Express 3.0 |
| Component for | Laptop |
| NVMe | Yes |
| NVMe version | 1.3 |
| TBW rating | 480 |
| PCI Express interface data lanes | x4 |
| SSD capacity | 512 GB |
| S.M.A.R.T. support | Yes |
| Read speed | 2000 MB/s |
| TRIM support | Yes |
| Write speed | 1100 MB/s |
| ECC | Yes |
| Memory type | 3D NAND |
| Random write (4KB) | 220000 IOPS |
| Random read (4KB) | 90000 IOPS |
| Native Command Queuing (NCQ) | Yes |
| Mean time between failures (MTBF) | 3000000 h |
| Design | |
| Component for | Laptop |
| Certification | CE, FCC, BSMI, UKCA |
| SSD form factor | M.2 |
| Weight & dimensions | |
| Width | 0.866" (22 mm) |
| Weight | 0.141 oz (4 g) |
| Height | 0.0937" (2.38 mm) |
| Depth | 1.18" (30 mm) |
| Operational conditions | |
| Operating temperature (T-T) | -20 - 75 °C |
| Storage temperature (T-T) | -55 - 75 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| Operating shock | 1500 G |
| Operating vibration | 20 G |
| Minimum operating temperature | -20 °C |
| Maximum operating temperature | 75 °C |
| Technical details | |
| Interface | PCI Express 3.0 |
| S.M.A.R.T. support | Yes |
| Operating temperature (T-T) | -20 - 75 °C |
| TRIM support | Yes |
| Storage temperature (T-T) | -55 - 75 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| ECC | Yes |
| Operating shock | 1500 G |
| Operating vibration | 20 G |
| Native Command Queuing (NCQ) | Yes |
| SSD form factor | M.2 |