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Heat Sink Compounds
Viscous fluid which increases the thermal conductivity of a thermal interface by filling microscopic air-gaps present due to the imperfectly flat and smooth surfaces of the components. In electronics, it is often used to aid a component's thermal dissipation via a heat sink.
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StarTech.com SILV5-THERMAL-PASTE heat sink compound Thermal paste 3.07 W/m·K 0.141 oz (4 g)
StarTech.com Thermal Paste, Metal Oxide Compound, Pack of 5 Re-sealable Syringes (1.5g / each), CPU/GPU Thermal Grease Paste (SILV5-THERMAL-PASTE) -
StarTech.com HEATGREASE20 heat sink compound 1.066 W/m·K 0.847 oz (24 g)
StarTech.com 20g Tube CPU Thermal Paste Grease Compound for Heatsinks - heat grease - cpu paste - thermal compound -
StarTech.com SILVGREASE1 heat sink compound Thermal paste 1.93 W/m·K 0.141 oz (4 g)
StarTech.com Thermal Paste, Metal Oxide Compound, Re-sealable Syringe (1.5g), CPU/GPU Thermal Grease Paste (SILVGREASE1)