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Transcend MTE370T 256 GB M.2 PCI Express 3.1 NVMe 3D NAND
SKU
TS256GMTE370T
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In stock
256GB, M.2 2230, 3D NAND, NVMe 1.3, PCIe 3.1 x4, S.M.A.R.T., TRIM, ECC, NCQ, 22x30x2.38, 4g
UNSPSC: 43201830
- Supports NVM command
- SLC caching technology
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
- NCQ command for better performance
- Full drive encryption with Advanced Encryption Standard (AES) (optional)
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Single-sided to fit perfectly in small form factor devices
- Space-saving M.2 form factor (30mm) – ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30μ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)
- Supports Transcend Scope Pro software
| SKU | TS256GMTE370T |
|---|---|
| EAN | 0760557850366 |
| Manufacturer | Transcend |
| Availability | Out of Stock |
Transcend's M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30µ" gold finger PCB and Corner Bond technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃~75℃.
| Hard drive | |
|---|---|
| PCI Express interface data lanes | x4 |
| SSD capacity | 256 GB |
| Memory type | 3D NAND |
| Data transmission | |
| Random write (4KB) | 280000 IOPS |
| Random read (4KB) | 140000 IOPS |
| Endurance | |
| Data retention | 3 year(s) |
| Mean time between failures (MTBF) | 3000000 h |
| Features | |
| Interface | PCI Express 3.1 |
| Component for | PC/Laptop |
| NVMe | Yes |
| NVMe version | 1.3 |
| Sequential write speed (CDM) | 1700 MB/s |
| Sequential read speed (CDM) | 2000 MB/s |
| TBW rating | 960 |
| PCI Express interface data lanes | x4 |
| SSD capacity | 256 GB |
| S.M.A.R.T. support | Yes |
| Data retention | 3 year(s) |
| TRIM support | Yes |
| Protection features | Shock resistant, Vibration proof |
| ECC | Yes |
| Memory type | 3D NAND |
| Random write (4KB) | 280000 IOPS |
| Random read (4KB) | 140000 IOPS |
| Native Command Queuing (NCQ) | Yes |
| Mean time between failures (MTBF) | 3000000 h |
| SSD form factor | M.2 |
| PCI Express CEM revision | 3.1 |
| Target workload | Mixed Use (MU) |
| M.2 SSD size | 2230 (22 x 30 mm) |
| Drive writes per day (DWPD) | 0.88 |
| Power | |
| Power consumption (average) | 3.5 W |
| Power consumption (idle) | 0.53 W |
| Operating voltage | 3.3 V |
| Performance | |
|---|---|
| Interface | PCI Express 3.1 |
| Component for | PC/Laptop |
| NVMe | Yes |
| NVMe version | 1.3 |
| Sequential write speed (CDM) | 1700 MB/s |
| Sequential read speed (CDM) | 2000 MB/s |
| TBW rating | 960 |
| PCI Express interface data lanes | x4 |
| SSD capacity | 256 GB |
| S.M.A.R.T. support | Yes |
| Data retention | 3 year(s) |
| TRIM support | Yes |
| ECC | Yes |
| Memory type | 3D NAND |
| Random write (4KB) | 280000 IOPS |
| Random read (4KB) | 140000 IOPS |
| Native Command Queuing (NCQ) | Yes |
| Mean time between failures (MTBF) | 3000000 h |
| PCI Express CEM revision | 3.1 |
| Design | |
| Component for | PC/Laptop |
| Protection features | Shock resistant, Vibration proof |
| SSD form factor | M.2 |
| Weight & dimensions | |
| Width | 0.866" (22 mm) |
| Weight | 0.141 oz (4 g) |
| Height | 0.0937" (2.38 mm) |
| Depth | 1.18" (30 mm) |
| Operational conditions | |
| Operating temperature (T-T) | -20 - 75 °C |
| Storage temperature (T-T) | -55 - 85 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| Operating shock | 15 G |
| Operating vibration | 20 G |
| Technical details | |
| Interface | PCI Express 3.1 |
| S.M.A.R.T. support | Yes |
| Operating temperature (T-T) | -20 - 75 °C |
| TRIM support | Yes |
| Storage temperature (T-T) | -55 - 85 °C |
| Protection features | Shock resistant, Vibration proof |
| Operating relative humidity (H-H) | 5 - 95% |
| ECC | Yes |
| Operating shock | 15 G |
| Operating vibration | 20 G |
| Native Command Queuing (NCQ) | Yes |
| SSD form factor | M.2 |
| Compliance certificates | BSMI, CE, Federal Communications Commission (FCC), UKCA |
| Other features | |
| Compliance certificates | BSMI, CE, Federal Communications Commission (FCC), UKCA |