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HPE Intel Xeon-Silver 4214R (2.4GHz/12-core/100W) Processor Kit for ProLiant DL360 Gen10
SKU
P15977-B21
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In stock
HPE Intel Xeon-Silver 4214R (2.4GHz/12-core/100W) Processor Kit for ProLiant DL360 Gen10, Intel Xeon Silver, LGA 3647 (Socket P), 14 nm, Tray, Intel, 4214R
UNSPSC: 43201503
| SKU | P15977-B21 |
|---|---|
| EAN | 0190017362557 |
| Manufacturer | HPE |
| Availability | In Stock |
HPE Intel Xeon-Silver 4214R (2.4GHz/12-core/100W) Processor Kit for ProLiant DL360 Gen10. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S. Width: 3.5" (88.9 mm), Depth: 4.25" (108 mm), Height: 1" (25.4 mm)
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 16.5 MB |
| Processor model | 4214R |
| Processor threads | 24 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.5 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 12 |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 1 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
|---|---|
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Packaging data | |
| Package type | Tray |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Width | 3.5" (88.9 mm) |
| Weight | 19 oz (540 g) |
| Height | 1" (25.4 mm) |
| Depth | 4.25" (108 mm) |
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|---|---|---|---|---|---|---|
| SKU |
P15977-B21
|
CD8069504449000
|
100-000000342
|
BX8071513900K
|
100-000000939
|
100-100001352WOF
|
| Manufacturer |
HPE
|
Intel
|
AMD
|
Intel
|
AMD
|
AMD
|
| Processor lithography |
up to 22nm
|
up to 22nm
|
N/A
|
N/A
|
N/A
|
up to 22nm
|
| Processor family |
Intel Xeon Silver
|
Intel Xeon Gold
|
AMD EPYC
|
Intel Core i9
|
AMD EPYC
|
AMD Ryzen Threadripper
|
| Processor socket |
LGA 3647 (Socket P)
|
LGA 3647 (Socket P)
|
Socket SP3
|
LGA 1700
|
Socket SP5
|
Socket sTR5
|
| Processor cores |
N/A
|
N/A
|
N/A
|
N/A
|
48
|
N/A
|
| On-board graphics card |
N
|
N
|
N/A
|
Y
|
N
|
N
|
| Discrete graphics card |
N
|
N
|
N/A
|
N
|
N
|
N
|
| Cooler included |
N
|
N
|
N/A
|
N
|
N/A
|
N
|
| Package type |
Tray
|
Tray
|
N/A
|
Box
|
N/A
|
Box
|
